Microstructural Analysis of Electromigration-Induced Voids and Hillocks
- 1 January 1991
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 19 references indexed in Scilit:
- Morphology of electromigration-induced damage and failure in Al alloy thin film conductorsJournal of Electronic Materials, 1990
- Grain size dependence of electromigration-induced failures in narrow interconnectsApplied Physics Letters, 1989
- A study of heating rate and texture influences on annealing hillocks by a statistical characterization of Al thin-film topographyJournal of Applied Physics, 1988
- Grain boundary diffusion mechanisms in metalsMetallurgical Transactions A, 1982
- Linewidth dependence of electromigration in evaporated Al-0.5%CuApplied Physics Letters, 1980
- Voids in thin as‐deposited gold films prepared by vapor depositionJournal of Vacuum Science and Technology, 1977
- Stress generation by electromigrationApplied Physics Letters, 1976
- Electromigration damage in aluminum-copper filmsThin Solid Films, 1976
- Grain Growth and Stress Relief in Thin FilmsJournal of Vacuum Science and Technology, 1972
- DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMSApplied Physics Letters, 1967