Thermal stress effects on capacitance and current characteristics of Cu/Si and Cu/TiN/Si Schottky-diodes
- 30 November 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 37-38, 211-219
- https://doi.org/10.1016/s0167-9317(97)00114-7
Abstract
No abstract availableKeywords
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