An Alternate Method of Fabricating Multilayer-Multichip Ceramic Substrates
- 1 June 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (2) , 150-153
- https://doi.org/10.1109/tchmt.1983.1136169
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- A Multilayer Ceramic Multichip ModuleIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
- Trends in Packaging Technology8th Reliability Physics Symposium, 1978
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969