Modelling the effect of temperature on product reliability

This publication has 7 references indexed in Scilit:

• An integrated approach to flow, thermal and mechanical modeling of electronics devices
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
• Mathematical modelling: a laser soldering process for an optoelectronics butterfly package
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
• Enhanced electronic system reliability - challenges for temperature prediction
  IEEE Transactions on Components and Packaging Technologies, 2002
• Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• A parametric study of flip chip reliability based on solder fatigue modelling
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2002
• Optimisation modelling for flip‐chip solder joint reliability
  Soldering & Surface Mount Technology, 2002
• Mechanical metallurgy.
  Published by Smithsonian Institution ,1961