Surface mount assembly failure statistics and failure free time
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 487-497
- https://doi.org/10.1109/ectc.1994.367548
Abstract
No abstract availableThis publication has 23 references indexed in Scilit:
- A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning ApproachJournal of Electronic Packaging, 1993
- An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder JointsJournal of Electronic Packaging, 1993
- Generic reliability figures of merit design tools for surface mount solder attachmentsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
- Predicting Thermal Fatigue Lifetimes for SMT Solder JointsJournal of Electronic Packaging, 1992
- Solder Creep-Fatigue Analysis by an Energy-Partitioning ApproachJournal of Electronic Packaging, 1992
- A fracture mechanics approach to thermal fatigue life prediction of solder jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- A Mechanistic Model for Solder Joint Failure Prediction Under Thermal CyclingJournal of Electronic Packaging, 1990
- Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder jointsJournal of Electronic Materials, 1989
- Package ReliabilityPublished by Springer Nature ,1989
- A microstructural study of the thermal fatigue failures of 60sn-40Pb solder jointsJournal of Electronic Materials, 1988