GRINDING-AND-SLICING TECHNIQUE AS AN ADVANCED TECHNOLOGY FOR SILICON WAFER SLICING

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Abstract
Monocrystalline silicon wafers of high purity are widely used as substrate materials in microelectronic industry. One step is to cut the ingot into thin wafers. For further improvement of this process-step a new grinding-and-slicing (GS) technique has been developed, which allows the production of high quality wafers. To ensure an efficient and economic use of the GS technique, the application of monitoring systems is indispensable due to the high complexity of the process. A monitoring system for tool wear and radial concentricity error of the inner diameter (ID) blade for ID- and GS-sawing machines is presented. The functions of the monitoring system are based on acoustic emission because of the high sensitivity, the robustness, and the low system cost.