Characteristics of chemical-vapor-deposited copper on the Cu-seeded TiN substrates
- 31 December 1997
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 311 (1-2) , 218-224
- https://doi.org/10.1016/s0040-6090(97)00472-0
Abstract
No abstract availableKeywords
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