Oxidation behavior of Au-Si films

Abstract
We have investigated the oxidation behavior of co-deposited Au-Si films at low temperatures (∼200 °C). Alloys spanning the Au-Si phase diagram have been examined. Films with greater than 40 at. % Au were found to oxidize forming SiO2, while films with less than 40 at. % Au were found to be relatively stable in an oxidizing ambient. This phenomenon was used to form Au lines with a self-passivating SiO2 coating. The resistivity of these lines is estimated to be 6–10 μΩ cm.

This publication has 3 references indexed in Scilit: