Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) films
- 29 November 2001
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 398-399, 657-662
- https://doi.org/10.1016/s0040-6090(01)01372-4
Abstract
No abstract availableKeywords
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