A model for linewidth-dependent electromigration lifetime and its application to design rule scaling for narrow interconnects
- 15 February 1991
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 69 (4) , 2656-2661
- https://doi.org/10.1063/1.348659
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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- Electromigration failure modes in aluminum metallization for semiconductor devicesProceedings of the IEEE, 1969