The influence of bias sputtering and wafer preheating on the step coverage of sputtered aluminium
- 1 October 1982
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 96 (4) , 291-299
- https://doi.org/10.1016/0040-6090(82)90513-2
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Evolution and Current Status of Aluminum MetallizationJournal of the Electrochemical Society, 1976
- The influence of bias on the depostion of metallic films in rf and dc sputteringJournal of Vacuum Science and Technology, 1974
- Processes for multilevel metallizationJournal of Vacuum Science and Technology, 1974
- Effect of substrate bias and deposition temperature on the properties of thick sputtered chromium depositsJournal of Applied Physics, 1972
- Contamination in Films Sputtered From Hot-Pressed TargetsJournal of Vacuum Science and Technology, 1971