0.18-μm fully-depleted silicon-on-insulator MOSFET's
- 1 June 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 18 (6) , 251-253
- https://doi.org/10.1109/55.585344
Abstract
High-performance 0.18-/spl mu/m gate-length fully depleted silicon-on-insulator (FD-SOI) MOSFET's were fabricated using 4-nm gate oxide, 35-nm thick channel, and 80-nm or 150-nm buried oxide layer. An elevated source/drain structure was used to provide extra silicon during silicide formation, resulting in low source/drain series resistance. Nominal device drive currents of 560 /spl mu/A//spl mu/m and 340 /spl mu/A//spl mu/m were achieved for n-channel and p-channel devices, respectively, at a supply voltage of 1.8 V. Improved short-channel performance and reduced self-heating were observed for devices with thinner buried oxide layers.Keywords
This publication has 3 references indexed in Scilit:
- Subthreshold MOSFET conduction model and optimal scaling for deep-submicron fully depleted SOI CMOSPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Subthreshold kinks in fully depleted SOI MOSFET'sIEEE Electron Device Letters, 1995
- Deep-submicrometer channel design in silicon-on-insulator (SOI) MOSFET'sIEEE Electron Device Letters, 1994