Techniques for fabrication of wafer scale interconnections in multichip packages
- 1 June 1989
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 12 (2) , 195-205
- https://doi.org/10.1109/33.31424
Abstract
No abstract availableThis publication has 23 references indexed in Scilit:
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