Mechanical reliability in electronic packaging
- 1 April 2002
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 42 (4-5) , 607-627
- https://doi.org/10.1016/s0026-2714(02)00037-9
Abstract
No abstract availableThis publication has 25 references indexed in Scilit:
- The Effect of Solder Pad Metallization on Solder Fatigue Life and Crack Growth Life.Journal of The Japan Institute of Electronics Packaging, 2001
- Chip Scale Package Solder Joint Reliability Modeling and Material Characterization.Journal of The Japan Institute of Electronics Packaging, 2000
- Effect of adhesive surface chemistry and morphology on package cracking in tapeless lead-on-chip (LOC) packagesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Cracking failures in lead-on-chip packages induced by chip backside contaminationIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
- Stress Intensity Factors for Interface Crack between Dissimilar Orthotropic Materials. The Case Where Principal Axes Are Not Aligned with the Interface.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1994
- Problems of Joints in Packaging of Electronic Devices.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1994
- Failure mechanism models for cyclic fatigueIEEE Transactions on Reliability, 1993
- Two Edge-Bonded Elastic Wedges of Different Materials and Wedge Angles Under Surface TractionsJournal of Applied Mechanics, 1971
- Stress Distribution in Bonded Dissimilar Materials With CracksJournal of Applied Mechanics, 1965
- Stress Distribution in a Nonhomogeneous Elastic Plane With CracksJournal of Applied Mechanics, 1963