Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints
- 1 April 2002
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 99 (1-2) , 188-193
- https://doi.org/10.1016/s0924-4247(01)00880-9
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
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