Improvement of Oxide Leakage Currents in MOS Structures by Postirradiation Annealing
- 1 November 1990
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 29 (11A) , L2111-2113
- https://doi.org/10.1143/jjap.29.l2111
Abstract
Postirradiation annealing was used to efficiently reduce the oxide leakage currents in MOS structures after sample preparation. Generally, it is found that leakage currents exist more or less in oxide no matter how the oxidation process changes. However, when a sample receives an irradiation of 60Co with a total dose of 106 rads (SiO2) and an anneal in N2 at 400°C for 10 minutes successively, its high-frequency and quasi-static capacitance-voltage (C-V) curves are nearly coincident in the accumulation region. It is shown that in each postirradiation annealing, the irradiation improves the oxide leakage current while the anneal recovers the radiation-induced damage. Both the bulk oxide leakage current and the surface leakage current are suitably improved after postirradiation annealing.Keywords
This publication has 4 references indexed in Scilit:
- Improvement of hot-electron-induced degradation in MOS capacitors by repeated irradiation-then-anneal treatmentsIEEE Electron Device Letters, 1990
- Dramatic improvement of hot-electron-induced interface degradation in MOS structures containing F or Cl in SiO/sub 2/IEEE Electron Device Letters, 1988
- Thermal Annealing of Radiation Induced Defects: A Diffusion-Limited Process?IEEE Transactions on Nuclear Science, 1983
- Radiation-Induced Defects in SiO2 as Determined with XPSIEEE Transactions on Nuclear Science, 1982