Thermal cycling reliability of die bonding adhesives
- 1 January 1993
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
A study of thermal cycling endurance of three different die attach adhesives by measuring the increase in thermal resistance during a thermal cycling test is discussed. Test chips were bonded to three substrates with different coefficients of thermal expansion. The thermal resistance increased with increased number of temperature cycles. A large mismatch in thermal expansion gave the fastest increase in thermal resistance. The study also revealed a significant difference in behavior between the different adhesives.Keywords
This publication has 2 references indexed in Scilit:
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- Properties of Die Bond Alloys Relating to Thermal FatigueIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979