Thermal isolation of high-temperature superconducting thin films using silicon wafer bonding and micromachining
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 2 (4) , 160-164
- https://doi.org/10.1109/84.273092
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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