Stable Metallization Systems for Solar Cells
- 16 August 1982
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 72 (2) , 763-769
- https://doi.org/10.1002/pssa.2210720240
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Contact resistivities of sputtered TiN and TiTiN metallizations on solar-cell-type-siliconSolar Energy, 1981
- Electrical characteristics of TiN contacts to N siliconJournal of Applied Physics, 1981
- Diffusion barriers in layered contact structuresJournal of Vacuum Science and Technology, 1981
- High-temperature contact structures for silicon semiconductor devicesApplied Physics Letters, 1980
- Investigation of titanium—nitride layers for solar-cell contactsIEEE Transactions on Electron Devices, 1980
- TiN and TaN as diffusion barriers in metallizations to silicon semiconductor devicesApplied Physics Letters, 1980
- TiN as a diffusion barrier in the Ti-Pt-Au beam-lead metal systemThin Solid Films, 1979
- Diffusion barriers in thin filmsThin Solid Films, 1978
- Contact Resistance and Contact ResistivityJournal of the Electrochemical Society, 1972
- Interstitial AlloysPublished by Springer Nature ,1967