Predicting solder joint reliability, model validation
- 30 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Predicting plated-through-hole reliability in high temperature manufacturing processesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy SubstrateJournal of Electronic Packaging, 1991
- Constitutive relation and creep-fatigue life model for eutectic tin-lead solderIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990