Polysilicon Surface Modification Technique To Reduce Sticking Of Microstructures
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 206-209
- https://doi.org/10.1109/sensor.1995.717142
Abstract
A new and simple surface modification technique is proposed to reduce sticking of microstructures fabricated by surface micromachining. This technique realizes very rugged surface at substrate polysilicon, resulting in reduced sticking through decrease of real contact area. The surface, which consists of honeycomb shaped grain holes at the substrate polysilicon layer, is defined by two-step dry etch without additional masking step for photolithography nor deposition of thin films. By varying the time for etching grain holes of substrate polysilicon, controlled surface roughness can be obtained. Test structures, including various length of polysilicon cantilever beams and micro bridges, fabricated by surface micromachining with proposed surface modification shows twice increase of detachment length without sticking to substrate.Keywords
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