Low temperature silicon direct bonding for application in micromechanics: bonding energies for different combinations of oxides
- 30 October 1998
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 70 (3) , 271-275
- https://doi.org/10.1016/s0924-4247(98)00102-2
Abstract
No abstract availableKeywords
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