Silicon wafer bonding via designed monolayers**
- 1 July 1995
- journal article
- research article
- Published by Wiley in Advanced Materials
- Vol. 7 (7) , 662-665
- https://doi.org/10.1002/adma.19950070714
Abstract
Silicon wafer bonding is a technology which allows two silicon wafers to stick together without any glue (e.g. see Fig.). The technique is used in the areas of microelectronics, micromechanics, and power electronics. Hydrolyzed tetramethoxysilane is used in he new bonding process presented here, providing a low‐temperature method of wafer bonding compatible with the presence of microelectronics aluminum metallization magnified image .Keywords
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