Batch transfer of microstructures using flip-chip solder bonding
- 1 March 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 8 (1) , 27-33
- https://doi.org/10.1109/84.749399
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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