Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish
- 1 September 2001
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (9) , 1152-1156
- https://doi.org/10.1007/s11664-001-0143-7
Abstract
No abstract availableKeywords
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