Strain Relaxation and In-Situ Observation of Voiding in Passivated Aluminum Alloy Lines.
- 1 January 1993
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- High Resolution Observation of Void Motion in Passivated Metal Lines Under Electromigration StressMRS Proceedings, 1992
- X-Ray Determination of Residual Stresses of Encapsulated Thin Aluminum LinesMRS Proceedings, 1992
- Stress in metal lines under passivation; comparison of experiment with finite element calculationsApplied Physics Letters, 1991
- High-Energy Backscattered Electron Imaging of Voids in Aluminum MetallizationsMRS Proceedings, 1991
- Calculation of Stress Gradients in Thin Al-0.5%Cu/Ti Lines from Strain Gradients Measured as a Function of Temperature Using Grazing Incidence X-Ray ScatteringMRS Proceedings, 1991
- Mechanical properties and microstructural characterization of Al-0.5%Cu thin filmsJournal of Electronic Materials, 1990
- The evolution of microstructure in Al-2 Pct Cu thin films: Precipitation, dissolution, and reprecipitationMetallurgical Transactions A, 1990
- X-ray diffraction determination of the effect of various passivations on stress in metal films and patterned linesJournal of Applied Physics, 1990
- Stresses in Passivated FilmsMRS Proceedings, 1990
- X-Ray Stress Studies of Passivated and Unpassivated Narrow Aluminum MetallizationsMRS Proceedings, 1990