Low-frequency modulation of pulsed d.c. or r.f. discharges for controlling the reactive magnetron sputtering process
- 1 December 1996
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 86-87, 722-727
- https://doi.org/10.1016/s0257-8972(96)03064-2
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Chemical and structural analysis of aluminium-oxygen coatings obtained by d.c. magnetron reactive sputtering: some features of the processSurface and Coatings Technology, 1995
- Reactive direct current magnetron sputtering of aluminum oxide coatingsJournal of Vacuum Science & Technology A, 1995
- Pulsed magnetron sputter technologySurface and Coatings Technology, 1993
- Dynamic control of reactive magnetron sputtering: A theoretical analysisThin Solid Films, 1990
- Advances in partial-pressure control applied to reactive sputteringSurface and Coatings Technology, 1989
- Modeling of reactive sputtering of compound materialsJournal of Vacuum Science & Technology A, 1987
- Partial pressure control of reactively sputtered titanium nitrideJournal of Vacuum Science & Technology A, 1985
- Voltage controlled, reactive planar magnetron sputtering of AlN thin filmsJournal of Vacuum Science and Technology, 1982
- Discharge characteristics for magnetron sputtering of Al in Ar and Ar/O2 mixturesJournal of Vacuum Science and Technology, 1980