Characterization of via connections in silicon circuit boards
- 1 January 1988
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 36 (1) , 21-27
- https://doi.org/10.1109/22.3477
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Hybrid silicon wafer-scale packaging technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Multilevel interconnections for wafer scale integrationJournal of Vacuum Science & Technology A, 1986
- Slow-Wave Propagation in Two Types of Cylindrical Waveguides Loaded with a Semiconductor (Short Papers)IEEE Transactions on Microwave Theory and Techniques, 1985
- Properties of Microstrip Line on Si-SiO/sub 2/ SystemIEEE Transactions on Microwave Theory and Techniques, 1971