Preparation of Ta 2 Al intermetallic compound films and their application as diffusion barriers to Cu penetration
- 1 May 1996
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 278 (1-2) , 6-11
- https://doi.org/10.1016/0040-6090(95)08119-4
Abstract
No abstract availableKeywords
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