High-yield assembly of multichip modules through known-good IC's and effective test strategies
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Proceedings of the IEEE
- Vol. 80 (12) , 1965-1994
- https://doi.org/10.1109/5.192076
Abstract
No abstract availableThis publication has 64 references indexed in Scilit:
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