Formation of Amorphous Silicon by Ion Bombardment as a Function of Ion, Temperature, and Dose

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Abstract
The dose (fluence) of 200‐keV boron, phosphorous, and antimony ions required to produce a continuous amorphous layer in silicon is determined as a function of target temperature. EPR measurements are used to monitor the process which is also then related to annealing effectiveness. The continuous amorphous layer recrystallizes at 550°C, after which only the implanted ions within that layer are completely electrically active. Carrier concentration profiles indicate the position of the amorphous layer and allow an approximate determination of the distribution with depth of damage. At the low dose rates used, reasonable agreement with a simple model for the formation of amorphous silicon as a function of ion, temperature, and dose is obtained.