Effects of contact resistance and film thickness on current crowding and the critical product of electromigration in Blech structures

This publication has 16 references indexed in Scilit:

• Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
  Applied Physics Letters, 1998
• Electromigration Induced Failure as a Function of Via Interface
  MRS Proceedings, 1997
• Behavior of electromigration-induced gaps in a layered Al line observed by in situ sideview transmission electron microscopy
  Applied Physics Letters, 1996
• Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
  IBM Journal of Research and Development, 1995
• Stress evolution due to electromigration in confined metal lines
  Journal of Applied Physics, 1993
• Stress and Electromigration in Thin Film Metallisation
  MRS Proceedings, 1991
• Electromigration mechanisms in aluminum lines
  Solid-State Electronics, 1985
• Stress generation by electromigration
  Applied Physics Letters, 1976
• Electromigration in thin aluminum films on titanium nitride
  Journal of Applied Physics, 1976
• Coating, Mechanical Constraints, and Pressure Effects on Electromigration
  Applied Physics Letters, 1972