Manufacturing concerns of the electronic industry regarding intermetallic compound formation during the soldering stage
- 23 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- Hot air leveled tin: solderability and some related propertiesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- The growth of Cu-Sn intermetallics at a pretinned copper-solder interfaceMetallurgical Transactions A, 1992
- Analysis of low-temperature intermetallic growth in copper-tin diffusion couplesMetallurgical Transactions A, 1992
- The effect of Cu6Sn5 whisker precipitates in bulk 60sn-40pb solderJournal of Electronic Materials, 1987
- Intermetallic Growth Dependence on Solder Composition in the System Cu‐(Pb‐Sn Solder)Journal of the Electrochemical Society, 1981
- Barrier Layers Against DiffusionTransactions of the IMF, 1979
- Interdiffusion and formation of intermetallic compounds in tin-copper alloy surface coatingsSurface Technology, 1977
- Reaction-Diffusion in the Cu–Sn SystemTransactions of the Japan Institute of Metals, 1975
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973
- On the Growth of Alloy Layer between Solid Copper and Liquid TinTransactions of the Japan Institute of Metals, 1972