Effects of reflow on wettability, microstructure and mechanical properties in lead-free solders
- 1 October 2000
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1241-1248
- https://doi.org/10.1007/s11664-000-0019-2
Abstract
No abstract availableKeywords
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- Intermetallic growth and mechanical behavior of low and high melting temperature solder alloysMetallurgical and Materials Transactions A, 1994
- The effect of reflow process variables on the wettability of lead-free soldersJOM, 1993
- Issues in the replacement of lead-bearing soldersJOM, 1993