Self-encapsulation effects on the electromigration resistance of silver lines
- 31 March 2001
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 55 (1-4) , 389-395
- https://doi.org/10.1016/s0167-9317(00)00472-x
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
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