Core Structure of Thermal Donors in Silicon
- 29 July 1996
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review Letters
- Vol. 77 (5) , 861-864
- https://doi.org/10.1103/physrevlett.77.861
Abstract
Aggregation of oxygen impurities as a result of thermal annealing gives rise to “thermal” double donor defects in Si and Ge. A microscopic structure for the core of these defects is proposed on the basis of first-principles calculations. In Si, the core contains three oxygen atoms, exhibits bistability, and has a total energy appreciably lower than three isolated oxygen interstitials. Impurities such as B, Al, N, and H are found to bind strongly to the defect and to transform it into a shallow single donor.Keywords
This publication has 28 references indexed in Scilit:
- Oxygen loss during thermal donor formation in Czochralski silicon: New insights into oxygen diffusion mechanismsJournal of Applied Physics, 1995
- Observation of five additional thermal donor species TD12 to TD16 and of regrowth of thermal donors at initial stages of the new oxygen donor formation in Czochralski-grown siliconPhysical Review B, 1992
- Thermal double donors in siliconApplied Physics A, 1989
- United model for formation kinetics of oxygen thermal donors in siliconPhysical Review B, 1984
- Nature of thermal donors in silicon crystalsPhysica Status Solidi (a), 1984
- Spectroscopic studies of 450° C thermal donors in siliconPhysica B+C, 1983
- EPR spectra of heat-treatment centers in oxygen-rich siliconSolid State Communications, 1978
- New Oxygen Infrared Bands in Annealed Irradiated SiliconPhysical Review B, 1964
- Mechanism of the Formation of Donor States in Heat-Treated SiliconPhysical Review B, 1958
- Effect of Heat Treatment upon the Electrical Properties of Silicon CrystalsJournal of Applied Physics, 1957