Bias polarity dependent data retention of resistive random access memory consisting of binary transition metal oxide

The authors investigated the data retention properties of $\mathrm{Ni}{\mathrm{O}}_y$ resistors exposed to sputtered particles and found that they depended on the bias polarity used to program the data. Only the data in the high resistance state programmed by applying positive bias to the top electrode were easily damaged. This suggests that the “reset” process can take place when the anodic side of the conductive filaments, which were formed during the “forming” process, is insulated. In addition, the data retention test for thermal stress suggests that the reset process can take place thermally.