Abstract
Enhanced adhesion of a film of non-reactive metal deposited on a ceramic or glass substrate can be produced by irradiating the interface with an ion beam. The resulting bond can be improved by subsequent heat treatment. The interface remains abrupt. The mechanism of this bonding is discussed, and the effects of interface contaminants are examined for the Cu-Al2O3 and Au-Al2O3 systems. Finally it is noted that strong adhesion is produced when Al2O3 is subjected to preferential sputtering at the time of Cu deposition; the resulting interface chemistry is discussed.

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