Characterization of titanium nitride films deposited by cathodic arc plasma technique on copper substrates
- 1 August 2000
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 130 (2-3) , 290-296
- https://doi.org/10.1016/s0257-8972(00)00710-6
Abstract
No abstract availableKeywords
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