MOSFET degradation due to stressing of thin oxide
- 1 September 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 31 (9) , 1238-1244
- https://doi.org/10.1109/t-ed.1984.21694
Abstract
Oxide and interface traps in 100 Å SiO 2 created by Fowler-Nordheim tunneling current have been investigated using capacitor C-V, I-V, and transistor I-V measurements. The net oxide trapped charge is initially positive due to hole trapping near the anode interface and, at sufficiently high fluence, it becomes negative due to the trapping of electrons with a centroid of 60 Å from the injector (cathode) interface. Interface traps (Surface states) are created by tunneling electrons flowing to and from the substrate. The interface-trap energy distribution gives a distinct peak at 0.65 eV above the valence band edge. The positive charge trapping and interface traps generation saturate at high electron fluence, but not the electron trap generation. The generation rates for electron traps and interface traps are weak functions of tunneling current density over the range tested. The interface traps cause degradations in subthreshold current slope and surface electron mobility. The threshold-voltage shift can be either positive or negative under the combined influence of the oxide charges and the interface charges.Keywords
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