Stress relaxation behavior of eutectic tin-lead solder
- 1 October 1995
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 24 (10) , 1473-1484
- https://doi.org/10.1007/bf02655466
Abstract
No abstract availableKeywords
This publication has 23 references indexed in Scilit:
- Constitutive relations for tin-based solder jointsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- Constitutive relation and creep-fatigue life model for eutectic tin-lead solderIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Creep-fatigue interactions in soldersIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Investigation of the superplasticity of tin-lead eutectic by impression creep testsJournal of Materials Science, 1986
- The role of Coble creep and interface control in superplastic Sn-Pb alloysJournal of Materials Science, 1983
- On the uniqueness of stress-strain rate relation for superplastic flow of the Pb-Sn eutecticMetallurgical Transactions A, 1981
- Superplastic behavior of PbSn eutectic alloyMaterials Science and Engineering, 1979
- Stress relaxation in Tin-Lead soldersMaterials Science and Engineering, 1979
- The Influence of Temperature on Stress Relaxation in a Chill-Cast, Tin-Lead SolderIEEE Transactions on Parts, Hybrids, and Packaging, 1973
- Stress relaxation in superplastic materialsJournal of Materials Science, 1973