Thermal sensitivity analysis for the 119 PBGA-a framework for rapid prototyping
- 19 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- A measurement methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materialsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Thermal performance limits of the QFP familyIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1994