Development and Evaluation of a Preencapsulation Cleaning Process to Improve Reliability of HIC's with Aluminum Metallized Chips
- 1 December 1981
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 4 (4) , 429-438
- https://doi.org/10.1109/tchmt.1981.1135825
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Factors contributing to the corrosion of the aluminum metal on semiconductor devices packaged in plasticsMicroelectronics Reliability, 1976
- Aluminum + water reactionTransactions of the Faraday Society, 1969
- THIN SILICONE MEMBRANES‐THEIR PERMEATION PROPERTIES AND SOME APPLICATIONSAnnals of the New York Academy of Sciences, 1968