The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints
- 1 November 2000
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (11) , 1307-1311
- https://doi.org/10.1007/s11664-000-0130-4
Abstract
No abstract availableKeywords
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