A new flip-chip bonding technique using micromachined conductive polymer bumps
- 1 January 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Advanced Packaging
- Vol. 22 (4) , 586-591
- https://doi.org/10.1109/6040.803450
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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