Fully integrated electrothermal multidomain modeling of RF MEMS switches
- 23 September 2003
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Microwave and Wireless Components Letters
- Vol. 13 (9) , 364-366
- https://doi.org/10.1109/lmwc.2003.817121
Abstract
RF MEMS switches have demonstrated excellent performance. However, before such switches can be fully implemented, they must demonstrate high reliability and robust power-handling capability. Numerical simulation is a vital part of design to meet these goals. This paper demonstrates a fully integrated electrothermal model of an RF MEMS switch which solves for RF current and switch temperature. The results show that the beam temperature increases with either higher input power or increased frequency. The simulation data are used to predict switch failure due to temperature-related creep and self pull-in over a wide range of operating frequency (0.1-40 GHz) and power input (0-10 W). Self pull-in is found to be the dominant failure mechanism for an example geometry.Keywords
This publication has 14 references indexed in Scilit:
- Steady state thermal analysis and high-power reliability considerations of RF MEMS capacitive switchesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Electroplated rf MEMS capacitive switchesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- RF MEMS switches and switch circuitsIEEE Microwave Magazine, 2001
- High-isolation CPW MEMS shunt switches. 2. DesignIEEE Transactions on Microwave Theory and Techniques, 2000
- Adaptive relaxation algorithms for thermo-electromagnetic FEM problemsIEEE Transactions on Magnetics, 1999
- Mechanical Property Measurement of Electroplated Gold Microstructure Using Resonance MethodMRS Proceedings, 1999
- Finite Element Method ElectromagneticsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1998
- M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structuresJournal of Microelectromechanical Systems, 1997
- A finite-element-boundary-integral method for scattering and radiation by two- and three-dimensional structuresIEEE Antennas and Propagation Magazine, 1991
- A Novel Method for Measuring the Thermal Conductivity of Electrodeposited Gold FilmsJournal of the Electrochemical Society, 1980