Packaged photonic probes for an on-wafer broad-band millimeter-wave network analyzer
- 1 September 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Photonics Technology Letters
- Vol. 12 (9) , 1225-1227
- https://doi.org/10.1109/68.874243
Abstract
We report the fabrication of integrated and packaged active photonic probes that enable on-wafer measurements of electrical scattering parameters with a bandwidth exceeding 300 GHz. The probes use a high-speed uni-traveling-carrier photodiode (UTC-PD) to optically generate the electrical stimulus and the electro-optic sampling (EOS) technique to measure the electrical signals. The modules are packaged using micro-optic technology and exhibit excellent optical characteristics. They are easy to use, enable reliable and reproducible measurements, and should help to overcome the bandwidth-limitation of present all-electronic similar systems.Keywords
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