Microrelays for batch transfer integration in RF systems
- 7 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Design and modeling of RF MEMS tunable capacitors using electro-thermal actuatorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- 30 GHz tuned MEMS switchesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A micromachined RF microswitch applicable to phased-array antennasPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- MEMS and Si-micromachined components for low-power, high-frequency communications systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Micromachined low-loss microwave switchesJournal of Microelectromechanical Systems, 1999
- GaAs-compatible surface-micromachined RF MEMS switchesElectronics Letters, 1999
- Batch micropackaging by compression-bonded wafer-wafer transferPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1999
- Flip-chip assembly for Si-based RF MEMSPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1999
- Thermoelectric power sensor for microwave applications by commercial CMOS fabricationIEEE Electron Device Letters, 1997
- A multiline method of network analyzer calibrationIEEE Transactions on Microwave Theory and Techniques, 1991