Au-In bonding below the eutectic temperature
- 1 May 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (3) , 311-316
- https://doi.org/10.1109/33.232058
Abstract
No abstract availableThis publication has 22 references indexed in Scilit:
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