A low temperature bonding process using deposited gold-tin composites
- 1 February 1992
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 208 (2) , 202-209
- https://doi.org/10.1016/0040-6090(92)90643-p
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
- A new bonding technology using gold and tin multilayer composite structuresIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Void free bonding of large silicon dice using gold-tin alloysIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopyJournal of Electronic Materials, 1989
- Highly reliable die attachment on polished GaAs surfaces using gold-tin eutectic alloyIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Fluxless and virtually voidless soldering for semiconductor chipsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Successful alloy attachment of GaAs MMIC'sIEEE Transactions on Electron Devices, 1987
- Die bond materials and bonding mechanisms in microelectronic packagingThin Solid Films, 1987
- Failure analysis of die-attachment on static random access memory (SRAM) semiconductor devicesJournal of Electronic Materials, 1987
- A study of evaporated gold-tin films using transmission electron microscopyThin Solid Films, 1980
- Properties of Die Bond Alloys Relating to Thermal FatigueIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1979